Therapeutic Potential of Targeting Prokineticin Receptors in Diseases

M Vincenzi, A Kremić, A Jouve, R Lattanzi… - Pharmacological …, 2023 - ASPET
The prokineticins (PKs) were discovered approximately 20 years ago as small peptides
inducing gut contractility. Today, they are established as angiogenic, anorectic, and …

Reliable 300 mm wafer level hybrid bonding for 3D stacked CMOS image sensors

…, S Moreau, V Balan, F Fournel, A Jouve… - 2016 IEEE 66th …, 2016 - ieeexplore.ieee.org
3D Stacked Image sensor is the stacking of a Back-Side Illuminated (BSI) CMOS Image
Sensor on a logic die. It enables compact size, higher performances and additional …

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

…, A Farcy, S Guillaumet, A Jouve… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
Hybrid bonding is a high-density technology for 3D integration but further interconnect scaling
down could jeopardize electrical and reliability performance. A study of the influence of …

1μm Pitch direct hybrid bonding with< 300nm wafer-to-wafer overlay accuracy

A Jouve, V Balan, N Bresson… - 2017 IEEE SOI-3D …, 2017 - ieeexplore.ieee.org
Copper/oxide hybrid bonding process has been extensively studied these past years as a
key enabler for 3D high density application with top and bottom tier interconnection pitch …

Hybrid Au/CuO nanoparticles: effect of structural features for selective benzyl alcohol oxidation

M Marelli, A Jouve, A Villa, R Psaro… - The Journal of …, 2019 - ACS Publications
Hybrid Au/CuO NPs supported on carbon (Vulcan-XC72) with different Au/Cu molar ratios (ie,
13/1, 4/1, 1/1, and 1/17) were synthesized by the solvated metal atom dispersion approach…

Structural and mechanistic insights into low-temperature CO oxidation over a prototypical high entropy oxide by Cu L-edge operando soft X-ray absorption …

…, M Fracchia, A Tofoni, L Braglia, A Jouve… - Physical Chemistry …, 2021 - pubs.rsc.org
High entropy oxides (HEOs) are an emerging class of materials constituted by multicomponent
systems that are receiving special interest as candidates for obtaining novel and …

New challenges and opportunities for 3D integrations

…, E Deloffre, Y Sanchez, A Jouve… - 2015 IEEE …, 2015 - ieeexplore.ieee.org
From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high
densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product …

[HTML][HTML] Modulation of milking performance, methane emissions, and rumen microbiome on dairy cows by dietary supplementation of a blend of essential oils

A Bach, G Elcoso, M Escartín, K Spengler, A Jouve - animal, 2023 - Elsevier
Cattle represent a high contribution of the livestock's greenhouse gas emissions, mainly in
the form of methane. Essential oils are a group of plant secondary metabolites obtained from …

Integration of a temporary carrier in a TSV process flow

…, A Astier, J Brun, N Sillon, A Jouve… - 2009 59th Electronic …, 2009 - ieeexplore.ieee.org
Three-dimensional (3-D) wafer stacking technologies offer new possibilities in terms of device
architecture and miniaturization. To stack wafers, reliable through-silicon vias (TSVs) and …

Characterization of extreme ultraviolet resists with interference lithography

R Gronheid, HH Solak, Y Ekinci, A Jouve… - Microelectronic …, 2006 - Elsevier
This paper describes extreme ultraviolet (EUV) resist screening results that have been obtained
on an interference printer at the Swiss Light Source. Imaging performance of a variety of …